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Arctic Silver 5 Thermal Compound (2 Pack)

SKU: RM3989991863Category: Tags: ,
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$23.49

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The Storepaperoomates Retail Market » Catalog and Departments » Personal Computer » Arctic Silver 5 Thermal Compound (2 Pack)
Product Description

Brand: Arctic Silver 5

Features:

  • Premium silver polysynthetic thermal compound
  • Use between CPUs and heatsinks or water-cooling solutions
  • Will not separate run migrate or bleed
  • Does not contain any silicone
  • 3.5 gram tube will cover 20 to 30 small cpus

Details: Arctic Silver 5 High-Density Polysynthetic Silver Thermal Compound 3.5g AS5-3.5G Arctic Silver 5 premium thermal compound, with 99.9% pure micronized silver, is specifically designed to maximize the thermal conductivity between today’s high-powered processors and high-performance cooling assemblies. Arctic Silver 5 uses three unique shapes and sizes of near-pure silver particles to maximize particle-to-particle contact area and thermal transfer. It can reduce CPU core temperatures by up to 50°F over standard silicone thermal pastes. Controlled triple phase viscosity allows Arctic Silver 5 to fill, over time, microscopic valleys and gaps in CPU and heatsink surfaces. One 3.5g tube can cover up to 25 CPU cores. Made With 99.9% Pure Silver: Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. High-Density: Arctic Silver 5 contains over 88% thermally conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound’s performance and long-term stability Controlled Triple-Phase Viscosity: Arctic Silver 5 does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the syringe, Arctic Silver 5’s consistency is engineered for easy application. During the CPU’s initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical contact between the heatsink and the CPU core. Then the compound thickens slightly over the next 50 to 200 hours of use to its final consistency designed for long-term stability.

UPC: 617689108141

Package Dimensions: 13x68x32

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