CoolerCube Thermal Paste, 3g CPU Thermal Compound Paste, Heatsink Paste for All Coolers, CPU, GPU, IC Processor, Carbon Based High Performance, Thermal Interface Material

Brand: CoolerCube

Features:

• [UNIQUE PERFORMANCE]: high thermal conductivity (12.8 W/m.K), balance thermal resistance and viscosity can keep mushy for a long time, which enhance wettability and improve the thermal conductivity of contact surface, ensure heat dissipated quickly & efficiently.
• [SAFE APPLICATION]: non-volatile, flame retardant, metal-free and non-conductive, which eliminates the risk of short circuit and discharges and corrosion damage to the radiator bottom.
• [HIGH DURABILITY]: high stability & reliability polysynthetic thermal compound, at least 5 years last without addtional apply again.
• [EASY TO USE]: widely used for CPU, GPU, Coolers, IC Processor, Heatsink and DIY heat dissipation devices, suitable for beginners.
• [WHAT YOU GET]: 3 grams silicon thermal compound, spatula, scraper, clean package. Refund / Replacement services if delivery damanged.

Details: Carbon Based High Performance Thermal Compound Paste for All Coolers, CPU, GPU, IC Processor, Multi-Grams ChoicesFeature: 1. Unique Performance – high thermal conductivity (12.8 W/m.K), ensure heat dissipated quickly & efficiently 2. Unique Performance – balance thermal resistance and viscosity can keep mushy for a long time, which enhance wettability and improve the thermal conductivity of contact surface 3. Safety Application – non-volatile, flame retardant, metal-free and non-conductive, which eliminates the risk of short circuit and discharges 4. High Durability – high stability & reliability polysynthetic thermal compound, at least 5 years last without addtional apply 5. Available Choices – 2grams / 3grams / 4grams / 6grams / 9grams / 12grams / 18grams pacakge available 6. Easy to Install – compatible with CPU, GPU, Coolers, IC Processor, Heatsink and DIY heat dissipation devices etcSpecification: Product Name: Thermal Compound Paste Color: Grey Net Weight: 3 grams / 0.11 oz Thermal Conductivity: 12.8 W/m.k Density: 3.2 g/cm3 Viscosity: 550 Poise Thermal Resistance: 0.01 ℃. in2 / W @10psi Volume Resistivity: 1.0 x 10^12 Ω-cm Silicone-based: Yes Continuous Use Temperature: -40 ~ 150 ℃Typical Applications: compatible with kinds of CPUs, GPUs, Notebooks, ICs, Heatsink etcWhat you get: 3 grams silicon thermal compound 1 pack spatula 1 pack scraper1 pack clean package

UPC: 604007630224

Package Dimensions: 19x166x18