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Embedded Systems with ARM Cortex-M Microcontrollers in Assembly Language and C: Third Edition

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The Storepaperoomates Retail Market » Catalog and Departments » Book » Embedded Systems with ARM Cortex-M Microcontrollers in Assembly Language and C: Third Edition
Product Description

Author: Zhu Yifeng

Brand: E-Man Press LLC

Number Of Pages: 738

Details: Product Description

Significant changes in the third edition include updated serial communication description (UART, SPI, and I2C), new serial communication examples, incorporation of GNU gcc compiler, low power modes, modification of example programs from STM32L1 (Cortex-M3) to STM32L4 (Cortex-M4).

The book introduces basic programming of ARM Cortex-M cores in assembly and C at the register level, and the fundamentals of embedded system design. It presents basic concepts such as data representations (integer, fixed-point, floating-point), assembly instructions, stack, and implementing basic controls and functions of C language at the assembly level. It covers advanced topics such as interrupts, mixing C and assembly, direct memory access (DMA), system timers (SysTick), multi-tasking, SIMD instructions for digital signal processing (DSP), and instruction encoding/decoding. The book also gives detailed examples of interfacing peripherals, such as general purpose I/O (GPIO), LCD driver, keypad interaction, stepper motor control, PWM output, timer input capture, DAC, ADC, real-time clock (RTC), and serial communication (USART, I2C, SPI, and USB).

From the Back Cover

Book website: web.eece.maine.edu/~zhu/book/ Video tutorials: youtube.com/channel/UCY0sQ9hpSR6yZobt1qOv6DA

About the Author

Yifeng Zhu is Professor of Electrical and Computer Engineering at the University of Maine (UMaine). He received his Ph.D and M.S. in Computer Science from the University of Nebraska, and B.S. in Electrical Engineering from Huazhong University of Science and Technology (HUST). His current research interests include computer architecture and systems, data storage systems, energy-efficient memory systems, cloud computing, parallel and distributed computing, and wireless sensor networks. He has published more than 60 peer-reviewed conference and journal papers.

Release Date: 01-07-2017

Package Dimensions: 41x245x1300

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