- Product specifications: Thermal conductivity (W/mk): 12.8 W/mk; Color: Gray density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Specification size: 120×20 mm; Decomposition voltage: 9.8KV; Conductivity: None; Thickness of thermal pads: 0.5 mm
- This thermal pad 0.5mm, you can freely cut the thermal pads according to your needs, perfectly fill the contact surface gap, is a good helper for beginners and professionals who use Odyssey thermal pad.
- Product function: EXCELLENT THERMAL CONDUCTIVITY – 120x20x0.5mm, Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
- The thermal pad applied in electronic products, PC, CPU, GPU, PS4, Gelid, Heatsink, IC, LCD/PDP TV, LED lighting, automotive electronics, optoelectronics, graphics cards, DRAM memory modules, communication equipment, solid-state drives, automotive control equipment, Gaming equipment, laptops, and other industries, which Perfectly replaces traditional thermal paste heatsink compound grease.
- The thermal pads applied high-performance thermal conductive materials to eliminate air gaps, thereby improving the overall thermal conversion capability and enabling the device to work at a lower temperature, We are committed to providing high-quality thermal pads, easy to install, easy to Cutting.
Package Dimensions: 12x164x30