CPU-Cooler Thermal Grizzly Minus Pad 8-100 × 100 × 1,0 mm, TG-MP8-100-100-10-1R

Brand: Thermal Grizzly

Features:

• 8W/(m·K) THERMAL CONDUCTIVITY – Highly conductive and versatile, suitable for a wide range of configurations with basic to high requirements.
• COMPATIBILITY – Suitable for use with computers, laptops, PS3/4/5, Xbox 360/One/Series X consoles and Macbooks.
• UPGRADE – Designed for office, home, and gaming computers, catering to users who demand optimal performance from their equipment.
• GREAT RESULTS – The ceramic silicone and nano-aluminum oxide thermal pad effectively dissipates heat between components by filling small gaps with its flexible, highly conductive structure.
• USECASE – This is used in situations where thermal paste is not feasible, such as when dealing with a big air gap or an uneven substrate.

Details: Thermal Grizzly has been a leading manufacturer of cooling components for computers and consoles such as PS4, PS3, Xbox 360 and Xbox One X for years. The company’s products are considered reliable and durable and have their fans all over the world.
High-performance thermal inserts from the Thermal Grizzly Minus Pad 8 series have a very flexible and flexible surface with very high thermal conductivity. Even the smallest differences in components can be compensated very well. Available in various sizes and thicknesses.
Thermopad Thermal Grizzly Minus Pad 8 is a perfect solution for beginners who want to provide great thermal conductivity and optimize the operation of their cooling systems. After the first use, you can immediately see a significant drop in temperature, but not only. You’ll also notice a significant drop in volume. The thermal pad from Thermal Grizzly offers excellent compatibility with both air and liquid cooling systems. At the same time, it guarantees the absence of electrical conductivity and resistance to the passage of time, without hardening or loss of properties.
Grizzly Thermal Pad has a thermal conductivity of 8.0 W/mk and a temperature range of -100 °C/+250 °C, it is perfect for configurations supporting extremely demanding applications, which makes it an ideal solution also for industrial environments. and at the same time protects the contact surfaces, preventing the formation of micro-cracks. It is ideal for water cooling and for components that will be subject to OC.
Munus Pad 8 is characterized by high compressibility and flexibility as well as dielectric properties.

After removing the Minus Pad 8 thermally conductive mat, there were significantly less scratches on the surfaces of the lubricated elements. Application of motherboard chipset, memory modules, graphics card memory, graphics card GPU, notebooks.

UPC: 753677507326

Package Dimensions: 6x176x38